Samsung aims to compete with Intel and TSMC on 2 nm etching by 2025

Written by Guillaume
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Technological innovation sometimes gives the impression of a headlong rush by major semiconductor manufacturers.

Just a few days ago, we reported on Intel's plans for its etching process. In a conference call for investors, the American company confirmed its ambition to regain its number-two ranking in the semiconductor foundry sector, and to regain technological leadership from TSMC, which will remain the world's leading supplier. Intel has set itself the goal of outstripping its main competitors by 2025, with the launch of the Intel 18A etching process. This process will compete with TSMC's 2nm process, as well as with the 2nm process of third-placed Samsung.

The South Korean manufacturer has no intention of standing idly by while Intel and TSMC battle it out. Currently the world's second-largest semiconductor manufacturer, Samsung also sees 2025 as a turning point, and at the Samsung Foundry Forum in San Jose, California, Dr. Siyoung Choi, President and Head of Samsung Electronics' Foundry Business, declared that " mass production of chips using the 2 nm process will take place as early as 2025 ". This is not a new announcement as such, but rather the affirmation of a goal that had already been mooted in the autumn of 2022.

If all goes according to plan, 2025 will see the launch of mass production of 2 nm chips for Samsung's own components, as well as for chips designed by Qualcomm, with smartphones and tablets in its sights in either case. Thereafter, Samsung aims to extend the scope of the 2 nm process with chips for high-performance computing (HPC) in 2026 and automotive chips in 2027. The year 2027 should also mark another major milestone for Samsung, as the company estimates that it will then be able to ensure mass production of 1.4 nm chips. There's no stopping progress!